Mechanisms Engineer - Payloads
Core
Develop electromechanical flight hardware for pharmaceutical manufacturing and hypersonic reentry testbed missions, delivering systems from concept through build, test, launch, and recovery.
Role type
Senior IC mechanisms engineer (payloads)
Builds
Electromechanical assemblies, structures, and thermal/fluid interfaces for orbital payloads
Domain
Aerospace / Space infrastructure / Hypersonic reentry
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Mechanical fundamentals, structures, heat transfer, fluids, dynamics, electromechanical hardware design, integration, testing, troubleshooting, CAD, FEA
Preferred skills
Electromechanical actuators integration, sensors, thermal control hardware, fluid control hardware, NX CAD, Ansys/Nastran FEA, aerospace environmental testing
Technologies
NX, Ansys, Nastran
Responsibilities
Design mechanisms, structures, thermal/fluid interfaces, and electromechanical assemblies; Run structural, thermal, and fluid analyses; Build, instrument, and test prototypes and flight hardware; Work across avionics, software, thermal, systems, and integration teams; Generate documentation including requirements, ICDs, procedures, and test reports; Support mission operations and post-flight teardown.
Seniority
Mid-level to Senior, hands-on IC