NPC 2nd shift Build Engineer(E3)- Heterogenous Integration
Core
Develop and maintain methods, operating sequences, and processes for the fabrication of parts, components, subassemblies, and final assemblies for semiconductor equipment.
Role type
Manufacturing Engineer (Build Engineering)
Builds
Semiconductor equipment (specifically Plating Systems for Heterogenous Integration)
Domain
Semiconductor manufacturing / Materials science
Required skills
Lean principles, automation, continuous improvement, test procedure development, root cause analysis, Process Failure Mode & Effects Analysis (PFMEA), tooling and process requirements determination
Preferred skills
Interpersonal skills, consensus building
Technologies
Hand and power tools, clean room equipment
Responsibilities
Develop and maintain fabrication methods and operating sequences; Coordinate product improvements and new product releases; Lead Design for Excellence (DFx) initiatives to reduce costs and improve quality; Determine time standards and recommend tooling/process requirements; Evaluate test results and work methods; Identify root causes and provide corrective actions; Mentor junior engineers