PDC(XVision) Process Support Engineer
Core
Lead customer demos and evaluations for 2D/3D X-ray inspection tools in HBM manufacturing, developing imaging recipes and correlating X-ray data with electrical test and failure analysis results to control microbump, TSV, and die-stacking processes.
Role type
Senior IC process support engineer (X-ray metrology/inspection)
Builds
X-ray inspection and metrology capabilities for High Bandwidth Memory (HBM) manufacturing
Domain
Semiconductor manufacturing / Memory / X-ray inspection
Deliverable
production ML models
Required skills
X-ray inspection and metrology, HBM stacking processes (TSV, microbump, hybrid bonding), data analysis and statistics, root cause analysis, DOE design, Python/MATLAB/JMP, failure analysis correlation
Preferred skills
X-ray CT/XRM, 3D image analysis (reconstruction, segmentation), machine learning for image data, leading customer evaluations, X-ray physics fundamentals
Technologies
X-ray CT, XRM, Python, MATLAB, JMP, SEM/FIB, SAT/C-SAM
Responsibilities
Drive X-ray tool adoption from demo to qualification, develop and optimize 2D/3D imaging recipes, detect and quantify yield-critical defects, apply automated analysis and AI/ML for image enhancement, serve as technical liaison between customer and global product team, act as a resource for junior colleagues
Seniority
Senior, hands-on IC