Manufacturing Engineer III -(E3)
Core
Develop and maintain methods, operating sequences, and processes for fabricating parts, components, subassemblies, and final assemblies in a semiconductor equipment context.
Role type
Manufacturing Engineer III (IC)
Builds
Semiconductor equipment and components
Domain
Semiconductor manufacturing / Materials science
Required skills
Lean principles, automation, continuous improvement, process failure mode and effects analysis (PFMEA), root cause analysis, test procedure development, time standard determination, tooling and process requirements planning
Preferred skills
Interpersonal skills, consensus building
Technologies
Hand and power tools, clean room equipment, Personal Protective Equipment (PPE)
Responsibilities
Develop and maintain all methods, operating sequences, and processes in the fabrication of parts, components, subassemblies, and final assemblies; Work with other engineering functions to coordinate the release of product improvements and new products; Lead team in using design for excellence (DFx) principles to estimate and reduce manufacturing costs; Determine time standards and make recommendations for tooling and process requirements; Develop and use test procedures, evaluate test results, and evaluate work methods; Determine root causes and corrective actions for issues that arise during assembly or system testing; Mentor and train junior level engineers
Seniority
Mid-level (4-7 years experience), hands-on IC