Process Technician
Core
Prepare high-quality samples using Focused Ion Beam (FIB), Scanning Electron Microscopy (SEM), and Transmission Electron Microscopy (TEM) techniques to support semiconductor failure analysis, process development, and characterization activities.
Role type
FIB Technician (semiconductor failure analysis)
Builds
High-quality analytical samples and imaging data for engineering investigations
Domain
Semiconductor manufacturing and failure analysis
Required skills
FIB sample preparation, TEM lamella preparation, SEM operation, TEM operation, metrology tool operation, cross-sectional imaging, critical dimension (CD) measurement, energy dispersive spectroscopy (EDS) analysis, equipment maintenance, troubleshooting, data documentation
Preferred skills
Materials Science or Engineering Technology background, experience in semiconductor production or failure analysis laboratory
Technologies
FIB, SEM, TEM, metrology systems, Microsoft Office
Responsibilities
Prepare samples for experimentation including cleaning, mounting, and loading FOUPs; Prepare TEM lamella samples using FIB techniques; Operate SEM, FIB, TEM, and laboratory metrology tools; Perform cross-sectional and plan-view imaging, CD measurements, and EDS analysis; Operate and maintain SEM, FIB, TEM, and related metrology systems; Perform routine maintenance activities including plasma cleaning, flashing, and system checks; Interface with customers, engineers, and requestors to understand requirements and communicate results; Document rework activities and lessons learned
Seniority
Individual Contributor, hands-on technical role