R&D Process Engineer (Hybrid Bonding)
Core
Designing and optimizing manufacturing processes for display and semiconductor technologies, specifically focusing on hybrid bonding.
Role type
R&D Process Engineer (Hybrid Bonding)
Builds
Manufacturing processes for display and semiconductor chips
Domain
Semiconductor and Display Manufacturing
Required skills
Data collection and analysis, Hardware characterization, Root Cause Analysis, Film property measurement, Technical documentation, Vendor management, New technology implementation
Preferred skills
Semiconductor process development experience, Research focus in semiconductor field
Technologies
Analytical instrumentation, Hybrid Bonding modules
Responsibilities
Collect and analyze data from process engineering experiments, Perform hardware characterization on basic systems, Troubleshoot and resolve process engineering issues, Measure film properties and organize reports, Generate internal technical documentation, Engage with customers to resolve process issues, Collaborate with vendors and suppliers, Implement new technologies and products