Process Engineering Intern (Hybrid Bonding)
Based in Singapore
Core
Design, collect data, analyze, and compile reports on entry-level process engineering experiments for hybrid bonding system development in advanced packaging.
Role type
Intern, Process Engineering (Hybrid Bonding)
Builds
Hybrid bonding systems for advanced packaging
Domain
Semiconductor manufacturing / Advanced packaging
Required skills
Process engineering fundamentals, DOE execution, data analysis, metrology tool operation, cleanroom environment familiarity
Preferred skills
Analytical thinking, self-motivated learning, hands-on experimentation
Technologies
Industrial metrology & inspection tools, cleanroom equipment
Responsibilities
Design and execute process engineering experiments, support tool development and data interpretation to characterize industrial systems