Tech Proj/Prog Manager III S
Core
Owns the SSH product vision, strategy, and roadmap for Special Substrate Handling systems, driving alignment between engineering, customers, and business units to enable advanced packaging and AI-driven manufacturing.
Role type
Senior Product & Program Manager (Semiconductor Equipment)
Builds
Special Substrate Handling (SSH) systems and platforms for semiconductor manufacturing
Domain
Semiconductor equipment, advanced packaging, automation, robotics
Required skills
Product strategy, program management, system integration, cross-functional leadership, stakeholder management, business case development, market assessment, technical credibility with engineering teams
Preferred skills
Advanced packaging technology knowledge, AI/HPC market trends, non-standard substrate handling expertise, ecosystem partner engagement
Technologies
Robotics, sensors, algorithms, software controls, automation systems
Responsibilities
Own the SSH product vision, strategy, roadmap, and business case across all BUs; Drive alignment of system-level requirements between Platform COE, CSS, BU's, customers, and engineering teams; Translate customer challenges and advanced packaging technology trends into prioritized product and platform requirements; Lead cross-functional roadmap planning and execution; Partner with PDC, Metrology organizations, external vendors, and leading-edge customers to identify future substrate handling requirements; Act as the system integration leader for SSH capabilities across multiple product platforms; Establish governance, prioritization, and program management processes; Develop business growth strategies, market assessments, and value propositions
Seniority
Senior, hands-on IC with strategic scope
