Panel-level Advanced Packaging Process Engineer (PVD)
Core
Provide on-site technical support and process optimization for PVD metal deposition systems in panel-level advanced packaging environments.
Role type
Process Support Engineer (PSE)
Builds
Panel-level semiconductor and Heterogeneous Integration technologies
Domain
Semiconductor manufacturing, Advanced Packaging, Materials Science
Required skills
PVD metallization (seed, barrier, metal-stack), DOE design, statistical data analysis, root cause analysis, process stabilization, large-format panel handling
Preferred skills
FOPLP, chiplet integration, heterogeneous packaging, BEOL process flows, RDL metallization, wafer-level to panel-level transition
Technologies
PVD, Metal Deposition, Panel-level Packaging, Heterogeneous Integration
Responsibilities
Install, qualify, and troubleshoot PVD metal deposition systems on panel platforms; Optimize seed, barrier, and RDL metal stack deposition processes; Design and execute DOEs to analyze data and recommend process improvements; Diagnose and resolve complex process/equipment issues using root cause analysis; Address panel-specific challenges like film uniformity and warpage; Collaborate with customers and internal teams to achieve technical objectives; Mentor junior engineers on assigned projects.