Module Process Engineer-Wuxi/Shanghai-English+Korean Speaking
Core
Lead and solve customer High Value Problems (HVPs) for semiconductor equipment, optimizing tool performance and yield during development and ramp phases.
Role type
Senior IC Module Process Engineer (DDP/Etch)
Builds
Semiconductor manufacturing tools and processes for chip and display fabs
Domain
Semiconductor equipment and materials science
Required skills
DDP/Etch process expertise, root cause diagnostics, yield optimization, cost reduction, defect/variability reduction, Cpk/matching, output optimization, strategic application introduction, cross-module learning
Preferred skills
Cross-module learning, strategic new application projects
Technologies
DDP, Etch, FV troubleshooting methodologies
Responsibilities
Lead and solve customer HVPs independently or with support; Engage with customers during development, transfer, ramp, and HVM to understand impact on fab KPIs; Increase CSA value through defect/variability/COO reduction and PM/process Cpk/matching/output optimization; Identify and drive CIPs to improve tool performance; Resolve complex tool issues using analytics and systematic FV troubleshooting; Capture learnings in FV knowledge base to develop new BKM's; Support resolution of process-related escalations; Identify opportunities for CSA renewal/upsell/penetration.
Seniority
Senior, hands-on IC