多媒体EE工程师-PICO
Core
Design, evaluate, test, and validate hardware electronic solutions for critical components (screens, cameras) in smart hardware devices.
Role type
Senior IC hardware engineer (multimedia/EE)
Builds
Smart hardware devices (VR headsets, mobile platforms)
Domain
Consumer electronics / Multimedia hardware
Required skills
MIPI/eDP/IIC/SPI interface design and debugging, power architecture planning and module design, ECAD tool proficiency (PADS, Cadence), signal simulation, problem localization, soldering (0201 components), oscilloscope/spectrum analyzer operation
Preferred skills
VR headset design experience, mobile platform baseband design experience, screen/camera module electronic design, driver IC design and debugging, national electronic design competition participation
Technologies
MIPI, eDP, IIC, SPI, PADS, Cadence
Responsibilities
Design and evaluate electronic solutions for critical components; Design FPC layouts and power schemes for modules; Perform electrical testing, functional debugging, and driver coordination with software; Ensure performance matching and stability between components and the whole system; Support factory trial production and resolve electrical performance issues with baseband teams
Seniority
Senior, hands-on IC