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EE Lead

Shenzhen, China💼 Full-time🗓 2026-07-20 → 2026-07-31

Core

Lead system-level hardware architecture, design, and development for 3D printers and post-processing devices.

Role type

Senior IC hardware engineering lead (electromechanical)

Builds

3D printers and post-processing devices

Domain

Manufacturing / 3D printing / Electromechanical systems

Deliverable

physical/clinical work

Required skills

system-level hardware architecture, motion control, thermal design, embedded systems, 3D CAD (SolidWorks), manufacturing processes, hardware development lifecycle management, team leadership

Preferred skills

3D printer experience, CNC experience, robotics experience

Technologies

SolidWorks

Responsibilities

Lead system-level hardware architecture, design, and development; Drive selection and integration of core components (motion control, heating, sensors, embedded systems); Own full hardware development cycle (prototyping, testing, validation, DFM, cost); Ensure hardware meets performance, reliability, safety, and compliance standards; Manage hardware development timeline and collaborate with firmware, software, and manufacturing teams; Build, mentor, and manage the hardware engineering team

Seniority

Senior, hands-on IC with management responsibilities

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