ウエハプロセスエンジニア（量産／加工・成膜・熱処理・洗浄プロセス／茨城）
Core
Leading production technology for semiconductor wafer processes (diffusion, LPCVD, PVD, wet cleaning, dry etching) to ensure stable, high-quality, and cost-effective manufacturing.
Role type
Senior IC wafer process engineer (production/leading)
Builds
Semiconductor wafers (microcontrollers, SoC, analog, power products) for automotive, consumer, and industrial markets
Domain
Semiconductor manufacturing (front-end processes)
Required skills
Semiconductor front-end process engineering, equipment setup and commissioning, yield and quality improvement, root cause analysis, equipment performance optimization, cost reduction, project leadership
Preferred skills
Experience with diffusion/LPCVD/PVD/wet cleaning/dry etching, statistical methods (SPC, FMEA, DOE), engineering background (materials, chemistry, electrical, mechanical, physics)
Technologies
Diffusion, LPCVD, PVD, Wet cleaning, Dry etching, SPC, FMEA, DOE
Responsibilities
Install and commission new/updated production equipment; establish mass production processes and manage process stability; analyze yield and quality issues and implement countermeasures; diagnose equipment faults and improve equipment performance; drive cost reduction initiatives; lead cross-functional improvement projects
Seniority
Senior, hands-on IC with team leadership