中間工程・後工程プロセス技術（WET・インテグレーション・メタル成膜・リソグラフィ）(1)
Core
Developing and scaling wet etching, metal deposition, and lithography processes for intermediate and back-end semiconductor manufacturing of Smart Power Stage (SPS) products like PT and VPS.
Role type
Semiconductor process engineer (wet etching, integration, metal deposition, lithography)
Builds
Embedded power modules (PT, VPS) and chiplet technologies
Domain
Semiconductor manufacturing / Power electronics
Required skills
wet etching process development, metal deposition process development, lithography process development, semiconductor manufacturing scale-up, process troubleshooting, yield improvement, new material evaluation, equipment evaluation, cost reduction
Preferred skills
power device knowledge, reliability testing, process improvement, quality management (ISO/IATF)
Technologies
Cu-RDL, back-side metal, Si thinning, CuTi etching, back-side Si etching, RDL, bumping
Responsibilities
Develop new product intermediate and back-end processes, support manufacturing line setup and mass production transition, improve product quality and yield, apply new materials and methods, reduce costs of existing processes
Seniority
Mid-level, hands-on IC