CareerPlan

Internship Printed Circuit Boards Material Characterization

Schwieberdingen, BW, deInternship2026-10-09 → 2026-11-11
On-site

Core

Investigate and evaluate new printed circuit board materials for autonomous driving applications, focusing on thermomechanical properties and design stress.

Role type

Intern, materials characterization engineer

Builds

Experimental data and material evaluations for PCB technologies

Domain

Automotive electronics / Materials science

Required skills

thermomechanical analysis (TMA), dynamic mechanical analysis (DMA), metallographic cross-sectioning, optical microscopy, statistical evaluation, MS Office

Preferred skills

initiative, independent work, structured approach, team-oriented mindset

Technologies

TMA, DMA, MS Office

Responsibilities

Conduct experiments using TMA and DMA, analyze specimens via metallographic cross-sectioning and optical microscopy, statistically evaluate experimental results

Seniority

Intern