Senior Director, Package Design Engineering
Core
Lead global Technical Program Management (TPM) for strategic AI/Datacenter Infrastructure Power NPI and package engineering programs, ensuring execution, quality, and production readiness.
Role type
Senior Director, Technical Program Management (IC with leadership)
Builds
AI/Datacenter Power packages (SiP/modules, Smart Power Stages, Vertical Power Stages, Power Modules, Discrete FET packages, battery management systems, PMICs) and associated manufacturing ramp.
Domain
Semiconductor industry, Power Management, Package Engineering, NPI, OSAT/CM management
Required skills
Technical Program Management, Semiconductor NPI, Package Development, OSAT/CM Management, Cross-functional Leadership, Risk Management, Executive Reporting, Root Cause Analysis, Process Optimization, Resource Alignment, Strategic Roadmap Execution
Preferred skills
Smart Power Stage/Vertical Power Stage expertise, SiC/GaN technologies, DBC/AMB substrates, Wafer-level/Flip-chip technologies, Formal TPM methodologies
Technologies
SiP, Smart Power Stages, Vertical Power Stages, Power Modules, Discrete FET packages, Battery Management Systems, PMICs, SiC, GaN, DBC, AMB, Wafer-level, Flip-chip
Responsibilities
Lead global TPM organization for AI/Datacenter Power NPI; Establish end-to-end NPI program plans and governance; Identify and mitigate technical, quality, and schedule risks; Lead cross-functional task forces for development challenges; Coordinate with OSAT/CM partners for assembly and qualification; Drive transition from development to volume manufacturing; Develop global TPM teams and establish high-performance culture.
Seniority
Senior Director, Global Leadership
