Senior Director Package & Assembly Engineering
Core
Lead organization responsible for packaging development, new product introduction (NPI), and assembly engineering continuous improvement for semiconductor products.
Role type
Senior Director, Technical Program Management & Engineering Leadership
Builds
Semiconductor packaging solutions and assembly processes for OSAT partners
Domain
Semiconductor manufacturing and packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
NPI program management, cross-functional technical task force leadership, OSAT/CM partner management, risk management, root-cause analysis, executive reporting, team building and mentoring, global team leadership, process optimization, qualification readiness, production ramp execution, strategic technology roadmap execution
Preferred skills
High-growth customer program support, formal technical program management methodologies, portfolio-level governance
Technologies
Semiconductor packaging technologies, assembly processes, statistical process control (SPC)
Responsibilities
Recruit and mentor packaging engineers; establish end-to-end NPI program plans and governance; lead cross-functional task forces for quality, reliability, and yield issues; monitor OSAT partner operations and drive EBR execution; transition programs from development to volume manufacturing; provide executive communication on program health and risks.
Seniority
Senior Director, strategic leadership with hands-on technical program management