Manufacturing Engineer
Core
Provide full support to achieve organizational objectives by ensuring machine stability, supporting production and new product development, and managing cost investments for semiconductor manufacturing processes.
Role type
Manufacturing Engineer (Semiconductor Assembly)
Builds
Semiconductor products (SPS) via assembly processes using dicing, bonding, and reflow equipment.
Domain
Semiconductor manufacturing / Electronics
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Machine stability & maintenance (Dicing, Pellet Bonder, Wire Bonder), Production planning & new product support, Cost reduction & investment management, Training & mentorship, Safety & compliance adherence, Management systems (5S, 3Tei, ISO, IATF)
Preferred skills
AI & Power Automation knowledge, Python/Java/C/C++/JavaScript/TypeScript/MySQL, Mandarin proficiency
Technologies
ASMPT Solder Printers, ViTrox Inspection Systems, Canon Bonding Platforms, 3S Reflow Systems, Python, Java, C/C++, JavaScript, TypeScript, MySQL
Responsibilities
Develop and review preventive maintenance (PM) standards for manufacturing machinery, coordinate major machine repairs, assist in new product development and machine setup, implement cost reduction projects and capacity expansion investments, mentor technicians and train peers, adhere to safety regulations and manage environmental/health concerns, maintain 5S & 3Tei practices and update documentation systems
Seniority
Individual Contributor