Resident Engineer
Core
Act as the primary technical liaison between Bosch Reutlingen and Philippine OSAT partners, ensuring production compliance, quality, and delivery.
Role type
Senior Resident Engineer (Semiconductor Packaging/Assembly)
Builds
Semiconductor leadframes and packages for Bosch automotive and industrial clients
Domain
Semiconductor Manufacturing (OSAT) / Electronics Packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work -> physical/clinical work (Manufacturing/Process Engineering)
Required skills
Semiconductor packaging engineering, SPC, FMEA, 8D problem-solving, Cpk analysis, MSA, IATF 16949, AEC-Q100, Change Management, NPI/Ramp-up support, Supply chain management
Preferred skills
Automotive-grade quality standards expertise, Multilevel stakeholder management, Root cause analysis
Technologies
SPC, FMEA, 8D, Cpk, MSA, IATF 16949, AEC-Q100
Responsibilities
Perform line audits and process confirmation checks; Analyze failure root causes and track 8D reports; Monitor process changes and support NPI ramp-ups; Resolve capacity bottlenecks and equipment constraints; Coordinate third-party customer audits; Drive manufacturing KPIs (Yield, Incoming Quality, Reliability)
Seniority
Senior, hands-on IC