Plate Process Engineer
Core
Develop, optimize, and control plating processes to ensure high product quality, yield, and manufacturing efficiency.
Role type
Process Engineer (Electroplating/Surface Finishing)
Builds
Plated components for semiconductor and industrial applications
Domain
Semiconductor manufacturing / Metal finishing / Wet chemistry
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
DOE, SPC, Six Sigma, PFMEA, root-cause analysis, analytical troubleshooting, process specification development, equipment qualification
Preferred skills
Semiconductor assembly plating, lead frame plating, AAS machine chemical analysis, metal-finishing processes
Technologies
Electroplating equipment, wet chemistry systems, SPC software, FMEA tools
Responsibilities
Develop and maintain process specifications, work instructions, FMEA, Control Plans, KPIV/KPOV, and troubleshooting guides; Support continuous improvement, cost reduction, automation, and productivity initiatives; Evaluate and qualify new plating equipment, chemicals, and process technologies; Collaborate with cross-functional teams to implement corrective and preventive actions for quality issues; Support new package and product qualifications, process transfers, and customer requirements
