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Intern - Technologist, Hardware Development Engineering (Studying Ph.D Degree)

BangPa-in, PHRA NAKHON SI AYUTTHAYA, th💼 Internship🗓 2026-09-14 → 2026-09-27

Core

Support machining and lapping process development for next-generation wafer technologies using modeling, simulation, and data analytics.

Role type

PhD intern in hardware development engineering (manufacturing processes)

Builds

Process capability improvements for wafer manufacturing

Domain

Semiconductor manufacturing / Precision engineering

Deliverable

production ML models | product features

Required skills

Modeling and simulation, Data analytics, AI/ML, Statistical analysis, Python, MATLAB, C/C++, Root cause analysis

Preferred skills

Research in machining/lapping/precision engineering, Design of Experiments (DOE), Sensor systems knowledge

Technologies

Python, MATLAB, C/C++

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