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ウエハプロセスエンジニア(開発/加工プロセス/茨城)(3)

Hitachinaka, jp💼 Full-time🗓 2026-09-11 → 2026-09-26

Core

Developing and optimizing front-end semiconductor manufacturing processes (Dry Etch, Lithography) for 150mm-300mm lines to improve yield, productivity, and enable new device launches.

Role type

Front-end process development engineer (semiconductor manufacturing)

Builds

Production-grade microcontrollers, SoCs, analog, and power devices for automotive, consumer, and industrial applications

Domain

Semiconductor manufacturing (front-end processes)

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

Dry Etch process expertise, Lithography process expertise, process development and optimization, equipment introduction and commissioning, troubleshooting, cross-functional technical collaboration

Preferred skills

Power device or thick-film process knowledge, OPC model/recipe creation, yield improvement project experience, line capacity expansion experience

Technologies

Dry Etch equipment, Lithography tools, 150mm-300mm manufacturing lines

Responsibilities

Develop and optimize front-end processes (Dry Etch, Lithography), launch processes for new devices, improve production technology (yield, productivity, cost), introduce and evaluate new equipment, troubleshoot existing lines, collaborate with device design/manufacturing/quality teams

Seniority

Mid-level to Senior, hands-on IC

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