中間工程・後工程プロセス技術（WET・インテグレーション・メタル成膜・リソグラフィ）(3)
Core
Developing and scaling wet etching, metal deposition, and lithography processes for intermediate and back-end semiconductor manufacturing of Smart Power Stage (SPS) chips, specifically for AI servers and embedded VPS modules.
Role type
Semiconductor Process Engineer (WET/Integration/Metal/Lithography)
Builds
Embedded VPS chips (Power Tower Modules, Vertical Power Stages) with Cu-RDL and back-side metal layers for AI servers and automotive applications.
Domain
Semiconductor manufacturing (Front-end to Back-end integration)
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Wet etching process development, Metal deposition process development, Lithography process development, Semiconductor mass production experience, Equipment evaluation, Material evaluation, Process cost reduction, Yield improvement
Preferred skills
Power device knowledge, Reliability testing, ISO/IATF quality standards, Chiplet technology
Technologies
CuTi etching, Back-side Si etching, Cu-RDL, Bumping, WET equipment, Lithography tools
Responsibilities
New product process development, Manufacturing line setup and mass production transition, Quality and yield improvement, Applying new materials and methods, Reducing process costs
Seniority
Mid-level, hands-on IC
