Senior Edge Applications Engineer (Hardware & Embedded Lab)
Core
Build physical sensor rigs, collect real-world time-series data, and deploy quantized TinyML models onto microcontrollers for non-visual sensing solutions.
Role type
Senior hands-on IC embedded applications engineer (TinyML/DSP)
Builds
Custom sensor arrays, prototype hardware setups, and edge AI solutions for industrial/automotive/consumer devices
Domain
Semiconductor / Embedded Systems / Digital Signal Processing
Deliverable
production ML models
Required skills
Embedded C/C++ firmware, TinyML deployment, Digital Signal Processing (FFT/spectral analysis), Bare-metal/RTOS programming, Low-level peripheral debugging (SPI/I2C/UART/CAN), Physical prototyping and PCB bring-up
Preferred skills
Experience with Renesas silicon (RA/RX/RL78), Oscilloscope and logic analyzer usage, 3D printing for sensor mounts
Technologies
TFLite Micro, CMSIS-NN, eIQ, FreeRTOS, Zephyr, ARM Cortex-M, Renesas RA/RX/RL78
Responsibilities
Assemble custom sensor rigs and microelectronic setups; Instrument physical systems to capture high-frequency time-series data; Build DSP feature extraction pipelines; Write real-time C/C++ firmware and low-level drivers; Debug edge firmware issues with customers; Mentor junior engineers on lab tasks
Seniority
Senior, hands-on IC
