Electrical New Product Engineering (ENPIE)
Core
Act as a technical bridge between internal hardware engineering and external contract manufacturing partners to ensure high-layer-count PCA designs are successfully translated into high-volume production readiness.
Role type
Senior IC Electrical New Product Introduction (NPI) Engineer
Builds
High-performance, high-layer-count Printed Circuit Assemblies (PCAs) and PCBs for data center networking equipment
Domain
Hardware engineering, PCB manufacturing, SMT assembly, Contract Manufacturing
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work -> production ML models (Incorrect mapping in thought, correcting to: physical/clinical work -> infrastructure/production artifacts)
Deliverable
Production-ready PCBs and PCA designs
Required skills
Advanced SMT and high-layer-count PCB assembly expertise, Design for Manufacturability (DFM), Failure analysis and root cause analysis, 8D methodology, PLM system management, BOM risk assessment, Cross-functional collaboration
Preferred skills
PCA Design/Layout experience, IPC standards knowledge
Technologies
Propel, Agile, PLM systems
Responsibilities
Drive PCA designs and resolve DFM issues for SMT and system integration, Optimize high-layer count PCB manufacturing and BGA assembly, Lead process validation, troubleshooting, and failure analysis, Manage NPI lifecycles from prototype to full production, Manage ECOs and version control via PLM systems, Drive continuous improvement in yield, cost, and quality
Seniority
Senior, hands-on IC
