Academic Internship in Mechanical Engineering (f/m/div.)
Core
Develop and validate simulation models (digital twins) to forecast quality and defect probability in Printed Circuit Board (PCBa) manufacturing processes, specifically focusing on reflow soldering.
Role type
Academic Intern, Mechanical Engineering (Simulation & Materials)
Builds
Digital twin simulation models for PCBa manufacturing
Domain
Automotive Electronics / Manufacturing Engineering
Deliverable
production ML models | research | infrastructure
Required skills
Fluid Mechanics, Strength of Materials, Finite Element Methods (FEM), Computational Fluid Dynamics (CFD), Python, Experimental Design, Data Analysis
Preferred skills
Ansys simulation software proficiency
Responsibilities
Conduct literature review on reflow soldering; Characterize material properties experimentally and analytically; Develop and validate simulation models; Implement automation strategies for simulation models using Python; Write thesis.
Seniority
Intern
