Mid-end and backend process technology (WET/Integration/Metal deposition/Lithography engineer)
Core
Developing and optimizing mid-end and backend semiconductor manufacturing processes (WET, Integration, Metal Deposition, Lithography) for embedded VPS and chiplet technologies to support AI servers and power devices.
Role type
Mid-level IC Process Engineer (Semiconductor Manufacturing)
Builds
Embedded VPS (Power Tower Module, Vertical Power Stage), chiplet-based power devices, and related semiconductor products.
Domain
Semiconductor manufacturing / Power electronics / Embedded systems
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
WET process development, semiconductor integration development, metal deposition process development, lithography process development, manufacturing line startup, mass production transition, yield improvement, new material development, new manufacturing method development, cost reduction activities
Preferred skills
Power device knowledge, reliability testing evaluation, process improvement and quality control, ISO/IATF compliance, semiconductor package development, wafer process technology startup
Technologies
WET processes, Integration processes, Metal deposition, Lithography, Cu-RDL, backside metal, ultra-thinning of Si, RDL, bumps, OPM, dicing
Responsibilities
Promote process development for mid-end and backend processing of new products, provide technical responses and reporting based on process development, support manufacturing line startup and mass production transition, promote product quality and yield improvement activities, support technology development of new materials and new manufacturing methods, support cost reduction activities in traditional processes
Seniority
Mid-level, hands-on IC
