後工程・組立プロセス／品質管理エンジニア
Core
Ensuring quality and reliability of automotive semiconductor packaging processes, leading cross-functional teams to resolve defects and maintain global standards.
Role type
Senior IC quality engineering specialist (semiconductor packaging)
Builds
High-reliability automotive microcontrollers and semiconductors for the global market
Domain
Automotive electronics / Semiconductor manufacturing
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Semiconductor back-end packaging experience, Reliability testing evaluation, Process improvement, Quality management, Technical degree (Mechanical/Materials/Electronics/Chemistry), Report writing
Preferred skills
Quality assurance/management experience, ISO/IATF/VDA audit experience, Customer handling experience
Technologies
Microsoft Word, Excel, PPT
Responsibilities
Handling customer complaints and failure analysis, Managing in-process defects and quality control, Leading continuous quality improvement activities, Conducting calibration and inspection analysis, Managing IATF16949/ISO audits, Overseeing cleanroom management
Seniority
Senior, hands-on IC