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Ingénieur Mainframe – Build & Packaging RTC (H/F)

Paris, fr💼 Full-time💰 $45–$60,000🗓 2026-03-24 → 2026-07-31

Core

Implementing migrations to RTC/EWM environments and providing Level 2/3 technical support for Mainframe systems.

Role type

Senior Mainframe Build & Packaging Engineer

Builds

Production build and packaging pipelines for COBOL/JCL/DB2 applications

Domain

Insurance / Mainframe (z/OS)

Deliverable

production ML models | product features | infrastructure

Required skills

Mainframe development (COBOL, JCL, USS, DB2), RTC (Rational Team Concert) source control management, build and packaging process optimization, technical troubleshooting

Preferred skills

Team collaboration, continuous improvement mindset, stakeholder communication

Technologies

z/OS, COBOL, JCL, USS, DB2, RTC

Responsibilities

Execute migrations to RTC/EWM environments, provide Level 2/3 user support, test and validate developer tools, optimize build and packaging processes, collaborate on source and deployment management

Seniority

Senior, hands-on IC

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