GQ FECQE Process Engineer
Core
Lead new product quality risk assessment and deploy Quality & Reliability control systems for front-end semiconductor manufacturing processes.
Role type
Senior IC process engineer (quality & reliability)
Builds
Quality control systems, risk assessments, and manufacturing process improvements for NAND/DRAM memory products.
Domain
Semiconductor manufacturing (NAND/DRAM)
Required skills
Semiconductor manufacturing process knowledge, model-based problem-solving, data-driven decision-making, root cause analysis, FMEA development, inline control point establishment, cross-functional collaboration, validation of manufacturing improvements.
Preferred skills
Package process knowledge, fail mode analysis, WLR/pWLR metrics expertise, organizational capabilities, independent work, cross-fab alignment.
Technologies
NAND traveler flow, Fab area processes, pFMEA, inline control points, Root cause analysis tools, CA/PA methodologies.
Responsibilities
Partner with cross-functional teams to establish end-to-end QRC processes; Identify FE process to package impact and ensure pFMEA governance; Establish inline control points with Fab PIE/RAM/QE; Support continuous improvement and problem-solving for manufacturing issues; Lead global projects to deploy quality-related systems; Drive validation of root cause and manufacturing improvements; Collaborate to deploy quality initiatives to improve WLR metrics.
Seniority
Mid-level, hands-on IC
