Staff/Principal Engineer, Advanced Package Metrology-Real-Time Defect Analysis
Core
Develop and enable innovative inspection and metrology techniques for high-performance memory products (HBM) and advanced packaging technologies.
Role type
Staff/Principal Engineer, Advanced Package Metrology-Real-Time Defect Analysis
Builds
Advanced packaging technologies for high-performance memory products
Domain
Semiconductor manufacturing / Advanced Packaging / Metrology
Deliverable
production ML models
Required skills
Python, R, SQL, Visual Basic, E3, FDC, RMS, SPC, DOE, defect analysis, wafer/assembly tools, metrology/RDA systems
Preferred skills
AI-assisted tools integration, process modeling, data analytics
Technologies
Power BI, E3, FDC, RMS
Responsibilities
Develop and optimize metrology recipes for semiconductor processes; Establish inspection methodologies and perform in-line characterization; Manage metrology tools and set up control plans/SPC charts; Collaborate with cross-functional teams to integrate manufacturing processes; Integrate AI-assisted tools to improve efficiency and quality.
Seniority
Staff/Principal, hands-on IC