Engineer Unit Process Engineering
Core
Sustain and develop robust manufacturing processes to drive yield, quality, and cost improvements in semiconductor assembly.
Role type
Unit Process Engineer (Semiconductor Assembly)
Builds
Semiconductor power systems and IoT solutions
Domain
Semiconductor manufacturing / Electronics
Required skills
Manufacturing process knowledge, Equipment knowledge, Statistical data analysis, Systematic problem-solving (8D, DMAIC, FTA), First level reliability knowledge, Yield and quality improvement, Cost reduction
Preferred skills
EOL / Molding Process Engineering experience, Semiconductor Assembly Manufacturing background, Ability to communicate with different levels of staff
Technologies
8D, DMAIC, Process Mapping, FTA, Fishbone
Responsibilities
Drive 8D closure for FAR, MRB, DDM, and SCAR; Lead yield and quality improvement activities; Participate in cost reduction activities; Anticipate and resolve production issues quickly.
