Engineer Unit Process Engineering
Core
Engineer Unit Process Engineering responsible for Pre-Assembly / FOL / EOL / Plating process engineering, sustaining and continuously improving qualified technologies in volume production, and supporting development of new technologies.
Role type
IC process engineer (semiconductor assembly manufacturing)
Builds
semiconductor power systems and IoT solutions
Domain
Semiconductor manufacturing / Power systems / IoT
Required skills
Pre-Assembly / FOL / EOL / Plating process engineering, volume production stability and yield improvement, new material and process qualification, 8D problem-solving methodology, statistical data analysis, first level reliability knowledge, manufacturing process and equipment knowledge
Preferred skills
systematic problem-solving (DMAIC, Process Mapping, FTA), auditing activities, technical consultation
Technologies
Pre-Assembly / FOL / EOL / Plating processes, manufacturing equipment
Responsibilities
Achieve robust and auto-pilot processes, drive 8D closure of FAR/MRB/DDM/SCAR, lead yield and quality improvement activities, support new technology take-over into volume production, provide technical consultation to the team
Seniority
Entry-level to Mid-level, hands-on IC
