Principal Engineer End of Line
Core
Lead Molding and Mark Trim Form processes for SON products, driving improvements in yield, quality, productivity, and cost in a semiconductor assembly cleanroom.
Role type
Principal Engineer Operations (Manufacturing)
Builds
SON products (semiconductor packages)
Domain
Semiconductor manufacturing / Power systems and IoT
Required skills
Transfer Molding, Marking Processes, Trim & Form Operations, TDSON packaging, DOE, SPC, FMEA, Six Sigma, statistical analysis, root cause analysis, process optimization, yield improvement, cost reduction, technical leadership, mentoring
Preferred skills
Experience with BESI, ASM, Asahi equipment
Technologies
BESI, ASM, Asahi, TDSON
Responsibilities
Lead Molding and Trim Form engineering activities for SON products; Optimize processes and equipment to improve manufacturing performance; Investigate and resolve process and quality issues using structured problem-solving methods; Drive root cause analysis, corrective actions, and continuous improvement initiatives; Develop and maintain process documentation, FMEA, control plans, and work instructions; Provide technical leadership and mentoring to junior engineers
Seniority
Principal, hands-on IC with strategic leadership
