Internship - Materials Innovation
Core
Internship role advancing polymer materials for electronic packaging, focusing on formulation development for Encapsulating Material Compounds (EMC) and AI application in materials discovery.
Role type
Intern, Materials Science/Chemical Engineering
Builds
Encapsulating Material Compounds (EMC) for electronic packaging
Domain
Semiconductor solutions, power systems, IoT
Deliverable
production ML models
Required skills
Polymer materials knowledge, Design of Experiments (DOE), Material characterization, AI application, Literature review, MATLAB, Python
Preferred skills
Computer Science/Computer Engineering/Electrical & Electronic/Material Science/Chemical Engineering background, Passion for innovation, Team collaboration, Independence