Staff Engineer Unit Process Engineering
Core
Lead root-cause analysis and process optimization for complex molding challenges in semiconductor manufacturing, driving yield, quality, and cost improvements.
Role type
Staff Engineer, Unit Process Engineering (Transfer Molding)
Builds
High-volume production of semiconductor components via transfer molding
Domain
Semiconductor manufacturing / Mold technology
Deliverable
physical/clinical work
Required skills
Transfer molding expertise, Moldability concepts, Fluid dynamics, 8D problem resolution, Process optimization, Reliability analysis, Systematic problem-solving (DMAIC, FTA, Fishbone), Technical leadership
Preferred skills
Experience with MapMold and Cavity technologies, Knowledge of gate placement and runner balance
Technologies
Transfer molding equipment, MapMold, Cavity
Responsibilities
Lead root-cause analysis for complex molding defects, Optimize transfer molding parameters, Review and approve gate placement and runner balance, Sustain qualified technologies in volume production, Drive 8D closure for FAR/MRB/DDM/SCAR, Participate in internal and external audits, Lead yield and quality improvement projects, Provide technical consultation to cross-functional teams
Seniority
Staff, hands-on IC with technical leadership