Internship - Test and Finish Equipment Engineering
Core
Intern supporting the operation, commissioning, and optimization of complex backend semiconductor test and finish equipment.
Role type
Intern, IC Equipment Engineering
Builds
Backend semiconductor test processes and equipment
Domain
Semiconductor manufacturing / Equipment Engineering
Required skills
Equipment operation and commissioning, Root-cause analysis, CAD (AutoCAD/SolidWorks), Statistical Process Control (SPC), Lean/Six Sigma, MS Excel
Preferred skills
JMP experience, Hands-on manufacturing coursework
Technologies
AutoCAD, SolidWorks, JMP, MS Office
Responsibilities
Maintain high-profile presence on manufacturing floor for sustaining support, Operate and commission complex backend semiconductor test equipment, Design and execute experiments for optimal equipment parameters, Resolve mechanical and assembly screening process issues, Participate in Lean/Six Sigma projects, Support SPC data collection and analysis, Create CAD drawings and process documentation