Principle Engineer for early failure mechanisms, methodologies and tools (f/m/div)
Core
Uncover root causes of errors, drive transformational improvements, and implement solutions to ensure product quality, reliability, and performance in semiconductor manufacturing.
Role type
Senior IC reliability engineer (burn-in and failure analysis)
Builds
High-quality, reliable semiconductor devices and processes
Domain
Semiconductor manufacturing / Quality & Reliability
Required skills
Burn-in methodologies, physical failure mechanisms, defect analysis, Fault Analysis (FA), wafer manufacturing process, data analysis, Design for Stress (DfS), cross-functional leadership, automotive quality mindset
Preferred skills
None stated
Technologies
None stated
Responsibilities
Act as technical lead and methodological expert for Burn-in (BI), Provide teaching and coaching on Burn-in topics, Support Design for Stress (DfS) sustaining activities, Serve as 1st level of support for internal customer inquiries, Drive long-term strategically important tasks, Collaborate with Front-End, Back-End, and product development teams, Lead customer communications about early topics, Contribute to continuous improvement of Quality Management Systems (QMS)
Seniority
Senior, hands-on IC
