Staff Engineer Maintenance
Core
Lead maintenance and reliability strategy for Wire Bond and Plasma equipment in semiconductor manufacturing, ensuring safe operations, high availability, and cost-effective execution.
Role type
Senior IC maintenance engineer (semiconductor equipment)
Builds
Reliable semiconductor production equipment (Wire Bond and Plasma)
Domain
Semiconductor manufacturing / Industrial maintenance
Required skills
Semiconductor equipment maintenance, Wire Bond processes, Plasma processes, Team leadership, TPM, Preventive maintenance, Predictive maintenance, Corrective maintenance, Cost control, Safety compliance
Preferred skills
Equipment troubleshooting, Technical team development, Continuous improvement initiatives
Technologies
Wire Bond equipment, Plasma equipment, Metrology equipment
Responsibilities
Develop comprehensive maintenance strategies, Lead maintenance teams for Wire Bond and Plasma, Manage maintenance costs, Manage maintenance systems and personnel, Coordinate TPM activities, Coordinate Safety, Health, and Environment activities, Investigate equipment breakdowns, Train and develop technical teams
Seniority
Senior, hands-on IC