Process Engineer
Core
Drive reliability and predictability in semiconductor manufacturing processes, resolve production issues, and lead continuous improvement projects.
Role type
Senior IC process engineer (backend semiconductor/electronic assembly)
Builds
Production processes, assembly and mechanical screening processes for power systems and IoT solutions
Domain
Semiconductor manufacturing, backend processes, electronic assembly
Required skills
Root cause analysis (8D), Lean Manufacturing, Six Sigma, FMEA (DFMEA/PFMEA), DOE, Control Plans, statistical analysis, CAD, mechanical drawing interpretation, project management, team leadership
Preferred skills
Military/aerospace standards knowledge, material characterization, APQP, supplier quality management
Technologies
8D, Lean, Six Sigma, DOE, FMEA, Control Plans, OCAP, CAD
Responsibilities
Resolve day-to-day production issues and drive root cause analysis; Apply manufacturing best practices to improve reliability; Lead projects to improve operational efficiency and reduce scrap; Implement continuous improvement initiatives (Lean/Six Sigma); Translate DFMEA to PFMEA for risk management; Support new product transitions from R&D to Pilot/HVM; Define long-term process technology roadmaps; Collaborate with OSATs and suppliers on material processes.
Seniority
Senior, hands-on IC