Senior Engineer Product Engineering
Core
Perform electrical failure analysis, root cause investigation, and yield improvement for Wi-Fi, Bluetooth, and PSoC semiconductor solutions.
Role type
Senior IC product engineering engineer (failure analysis)
Builds
Semiconductor chips for IoT, power systems, and mobility
Domain
Semiconductor manufacturing and testing
Required skills
electrical failure analysis, root cause analysis (RCA), yield analysis, 8D methodology, DOE, FMEA, statistical analysis, ATE test data analysis, semiconductor manufacturing knowledge
Preferred skills
UltraFlex/Advantest/Verigy tester experience, customer-facing reporting, presentation skills
Technologies
UltraFlex, Advantest, Verigy
Responsibilities
Perform electrical failure analysis and root cause investigation for customer returns; Drive FE/BE yield improvement, test optimization, and cost reduction initiatives; Support product qualification, fab transfers, and manufacturing process improvements; Analyze ATE test data on UltraFlex testers and conduct bench/system-level validation; Prepare customer-facing FA reports and lead corrective actions using 8D methodologies