CIFRE - Panel Level Package (PLP) development : interfaces characterization - H/F
Core
Develop an experimental and numerical approach to characterize interfaces in Panel-Level Packaging (PLP) stacks, understanding their mechanical behavior and failure mechanisms.
Role type
PhD Researcher (CIFRE) in Materials Science and Mechanics
Builds
Experimental methodology for interface characterization and mechanical testing protocols
Domain
Semiconductor manufacturing / Microelectronics / Materials Science
Deliverable
research
Required skills
X-ray tomography, Scanning Electron Microscopy (SEM), Atomic Force Microscopy (AFM), mechanical testing (Double Cantilever Beam, 4-point bending), instrumented indentation, multi-scale modeling
Preferred skills
Knowledge of microelectronics processes, semiconductor physics
Technologies
X-ray tomography, SEM, AFM, DBC, 4-point bending, instrumented indentation
Responsibilities
Characterize initial interface state using tomography and microscopy; Develop and adapt mechanical tests to solicit interfaces; Correlate structural characterizations with mechanical responses to identify failure modes.
Seniority
PhD Candidate (Researcher)