CareerPlan

CDD - Ingénieur Développement de Procédés (Chemical and Mechanical Polishing) F/H

Crolles, FranceFull-time2026-10-15 → 2026-11-12

Core

Develop, optimize, and industrialize chemical and mechanical polishing (CMP) and electroplating processes in a cleanroom environment for semiconductor manufacturing.

Role type

Process Development Engineer (CMP/Electroplating)

Builds

Semiconductor manufacturing steps and process modules

Domain

Semiconductor industry, materials physics and chemistry

Required skills

Cleanroom equipment operation, process optimization, recipe development, consumable management, process integration, technical reporting

Preferred skills

Supplier partnership, cross-functional collaboration, project management

Technologies

CMP equipment, electroplating systems, cleanroom tools

Responsibilities

Master polishing and electroplating processes and equipment to develop cleanroom steps; Optimize polishing profiles and fill profiles by adapting recipes and consumables; Participate in innovative process development and integration; Industrialize processes by training technicians and operators and implementing procedures and certifications; Propose improvements for process and integration for future technologies; Extend responsibility to multi-step technological modules within project groups after initial experience.