Senior Process Engineer, PVD
Core
Develop, qualify, optimize, and sustain metal deposition processes on Applied Materials Endura platforms to ensure process stability, film quality, and production yield improvement in semiconductor manufacturing.
Role type
Senior IC process engineer (PVD)
Builds
Metal thin films for semiconductor chips
Domain
Semiconductor manufacturing / Thin film deposition
Required skills
Metal PVD deposition, Thin film process, AMAT Endura tool operation, Process qualification, SPC analysis, Root cause analysis, Metrology interpretation, Equipment troubleshooting, Process optimization, Documentation
Preferred skills
Copper deposition experience
Technologies
Applied Materials Endura, SPC, Metrology tools
Responsibilities
Develop and optimize metal PVD deposition processes on AMAT tools; Support process qualification, ramp-up, and transfer to high-volume manufacturing; Monitor and improve key process metrics (thickness, resistance, uniformity, adhesion, stress, defectivity, yield); Perform tool setup, chamber matching, and baseline process tuning; Troubleshoot process excursions, tool drift, abnormal defects, and yield loss issues; Analyze metrology, SPC, and inline data to identify root causes and implement corrective actions; Collaborate with equipment, integration, yield, and production teams; Support preventive maintenance, chamber health checks, and process stability initiatives; Drive continuous improvement to reduce cost, cycle time, and process variation; Document process procedures, specifications, and control plans.