Process Engineer, Backfinish
Core
Support manufacturing and optimization of metallization and backgrind processes in a high-volume semiconductor environment.
Role type
Process Engineer (Backfinish)
Builds
Semiconductor chips (metallization and backgrind processes)
Domain
Semiconductor manufacturing
Required skills
Semiconductor process control frameworks (SPC, FMEA, APC), Root cause analysis, Process parameter definition, Equipment troubleshooting, Data analysis, Continuous improvement
Preferred skills
Metallization or wafer thinning process knowledge
Technologies
SPC, FMEA, APC
Responsibilities
Monitor and troubleshoot metallization and backgrind equipment and processes; Define and maintain process parameters, recipes, and control plans; Analyze process data to identify abnormalities and propose corrective actions; Participate in root cause analysis for process excursions and defects; Support debugging and qualification of process changes and new equipment; Collaborate with Production and Quality teams on issue containment and lot disposition; Monitor SPC/KPIs and report on process performance.
Seniority
Junior to Mid-level, hands-on IC