Plating Process Engineer
Core
Lead and support plating and backetch processes to ensure safe, efficient, and high-quality manufacturing operations in semiconductor production.
Role type
Senior Process Engineer (Plating & Backetch)
Builds
Semiconductor chips and components
Domain
Semiconductor manufacturing / Chemical processing
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
process ownership, root cause analysis, process control, statistical analysis, process capability improvement, data analysis, technical troubleshooting, cross-functional coordination, documentation, continuous improvement
Preferred skills
tin plating expertise, backetch expertise, technology transfer, process qualification, manufacturing ramp-up, SPC, DOE, FMEA, 8D, 5 Why, chemical process safety, bath control, contamination control, equipment optimization, mentorship
Technologies
SPC, DOE, FMEA, 8D, 5 Why, Microsoft Excel
Responsibilities
Own and optimize plating, waterjet, and backetch processes; lead troubleshooting and root cause analysis for yield loss and defects; define and improve process recipes and control plans; analyze process data to implement corrective actions; drive continuous improvement to reduce defects and costs; support process qualification and change management; collaborate with Production, Quality, Maintenance, and EHS teams; develop and maintain process documentation; mentor junior engineers and technicians; support capacity expansion and equipment upgrades.
Seniority
Senior, hands-on IC
