Wafer/Package Level testing Engineer
Core
Planning, execution, surveillance, data analysis, and reporting of package/wafer level Electrical Wafer Sorting/Final Test for Reliability supporting prototypes of discrete power technologies (SiC, IGBT, GaN) and bench characterization of power devices.
Role type
IC reliability and electrical characterization engineer
Builds
Reliability data and technology qualification reports for power semiconductor prototypes
Domain
Semiconductor manufacturing and power electronics
Required skills
Reliability physics, semiconductor physics, electronic devices, electrical characterization methods, numerical modeling, computer programming
Preferred skills
Problem solving, teamwork
Technologies
SiC, IGBT, GaN, MOSFETs, SiO2, IMD, PMD, T84 structures
Responsibilities
Execute electrical wafer sorting and final test for reliability; Perform bench characterization of power devices; Evaluate device physics of MOSFETs; Validate electrical static performances; Identify and help resolve technology issues arising from out-of-spec results.
Seniority
Mid-level, hands-on IC
