Photonic IC Design Engineer, Chip-to-System Integration
Core
Design photonic integrated circuits (PICs) and their packaging for high-power satellite payloads, ensuring chip-to-system integration for optical and electrical interfaces in space environments.
Role type
Senior IC photonic design engineer (chip-to-system integration)
Builds
Photonic integrated circuits (PICs), optical I/O packages, and high-speed modulator assemblies for satellite missions
Domain
Aerospace / Integrated Photonics
Required skills
PIC design and tapeout, high-speed modulator design, optical I/O design, photonic device simulation, 3D mechanical CAD, radiation/thermal-vacuum qualification, Python automation
Preferred skills
Inverse design/topology optimization, RF package design, heterogeneous/3D integration, closed-loop control of photonic devices
Technologies
Meep, Tidy3D, Lumerical FDTD, KLayout, gdsfactory, Cadence, SolidWorks, Inventor, Fusion, HFSS, Sonnet
Responsibilities
Design and simulate PIC devices and circuits from specification to tapeout; design high-speed modulators and co-design with RF/ASIC engineers; implement bias and tuning control hardware; set optical I/O requirements and integrate into floorplan and link budget; design mechanical package components in 3D CAD; drive radiation, thermal-vacuum, and vibration qualification; partner on test plan definition and automated characterization; carry high-speed electrical paths through the package.
Seniority
Senior, hands-on IC