Micro-electronics Technician
Core
Operate and maintain wire bonding equipment to perform precise gold ball, wedge, ribbon, alloy, and manganin wire bonding onto substrates like duroid and ceramic, and conduct microelectronic assembly including adhesive and epoxy application.
Role type
Micro-electronics Technician (Wire Bonding & Assembly)
Builds
Cooled infrared cameras and subsystems (IDCAs) for defense, space, and commercial industrial applications
Domain
Defense / Microelectronics Manufacturing
Required skills
Wire bonding (manual, semi-automatic, automated), Microelectronic assembly, Adhesive/epoxy application, Technical documentation interpretation, Equipment setup and calibration, Quality inspection, Troubleshooting
Preferred skills
Cleanroom protocols, ESD procedures
Technologies
Westbond, Duroid, Ceramic, Microscopes, Reticle, Bond puller
Responsibilities
Operate wire bonding equipment for gold ball, wedge, ribbon, alloy, and manganin bonding; Perform microelectronic assembly with adhesives and epoxies; Interpret build sheets, ICDs, and engineering drawings; Calibrate and optimize wire bonding machinery; Conduct in-process and final quality inspections; Troubleshoot production issues; Maintain cleanroom and ESD compliance
Seniority
Individual Contributor, Entry to Mid-level