CareerPlan

Engineer II, Field Process

HigashiHiroshima(ASM Japan K.K.)Full-time2026-10-23 → 2026-11-10

Core

Develop and optimize advanced thin-film deposition processes for semiconductor manufacturing customers, supporting process development, integration, and troubleshooting.

Role type

Field Process Engineer (Semiconductor Manufacturing)

Builds

Thin-film deposition processes and equipment solutions for semiconductor customers

Domain

Semiconductor manufacturing / Thin-film deposition

Required skills

Thin-film deposition process development, Process optimization, Root-cause analysis, Experimental design, Technical documentation, Data analysis, Equipment troubleshooting, Project execution, Cross-functional collaboration, Cleanroom operations

Preferred skills

ALD, PEALD, CVD, PECVD, Epitaxy, Furnace processes

Technologies

ALD, PEALD, CVD, PECVD, Epitaxy, Furnace

Responsibilities

Develop and optimize advanced thin-film deposition processes to meet customer requirements, Support customer process development projects and new product introductions, Investigate process and equipment technical issues and implement solutions, Analyze experimental and production data to identify improvement opportunities, Plan and execute process experiments and troubleshooting activities, Collaborate with customers and internal teams on process requirements and implementation plans, Support field escalations and quality investigations including root-cause analysis, Create and maintain technical documentation and reports, Drive continuous improvement for process capability, productivity, and yield, Participate in technical discussions regarding technology roadmaps

Seniority

Mid-level, hands-on IC